GigaDevice's Dual-Power Supply SPI <span style='color:red'>NOR Flash</span> for 1.2V SoCs Halves Read Power Consumption
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GigaDevice's Dual-Power Supply SPI NOR Flash for 1.2V SoCs Halves Read Power Consumption

　　GigaDevice, a leading semiconductor company specializing in flash Memory, 32-bit microcontrollers (MCUs), sensors, analog products and solutions, has unveiled the GD25NE series of dual-power supply SPI NOR Flash, designed specifically for 1.2 V system-on-chip (SoC) applications.　　The GD25NE series strengthens GigaDevice's strategic dual-power supply Flash roadmap, providing seamless compatibility with next-generation 1.2 V SoCs and eliminating the need for an external booster circuit. With its higher performance and lower power consumption, the GD25NE series addresses the growing demand for advanced embedded storage, making it an ideal choice for wearable devices, healthcare, IoT, data center and Edge AI applications.　　Combining a 1.8 V core voltage with a 1.2 V I/O interface voltage, GD25NE supports single, dual, quad STR (single transfer rate) and quad DTR (double transfer rate) operation. It achieves high-speed clock frequencies of up to 133 MHz in STR mode and 104 MHz in DTR mode.　　With a typical page program time of 0.15ms and sector erase time of 30ms, the GD25NE series significantly outperforms conventional 1.2 V-only Flash solutions—offering up to 20% faster read performance, over 60% faster program speed, and 30% reduction in erase time. Due to these advances, it makes the GD25NE series an outstanding choice for emerging embedded applications.　　The GD25NE series is engineered with ultra-low power consumption by design, making it ideal for energy-sensitive applications. It features a typical deep power-down current of just 0.2 µA, a Quad I/O DTR read current of 9mA at 104 MHz, and program/erase currents as low as 8 mA. Compared to conventional 1.8 V solutions, the 1.2 V design reduces power consumption by up to 50%. This optimized power architecture not only enhances power efficiency but also simplifies system design while maintaining higher performance.　　“The GD25NE series represents a new class of dual-supply SPI NOR Flash, delivering an optimal balance of high performance and ultra-low power consumption," said Ruwei Su, GigaDevice vice president and general manager of Flash BU, "With significantly reduced power usage, faster read speeds, and enhanced program/erase efficiency, this solution is designed to meet the evolving demands of next-generation 1.2 V SoCs. As part of our ongoing commitment to innovation, we continue to expand our portfolio, providing customers with more efficient, reliable, and future-ready Flash solutions for new leading-edge applications”
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Release time：2025-03-12 10:59 reading：485 Continue reading>>
GigaDevice GD25/55 Serial <span style='color:red'>NOR Flash</span> Automotive-Grade Product Family Certified for ISO 26262 ASIL D
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GigaDevice GD25/55 Serial NOR Flash Automotive-Grade Product Family Certified for ISO 26262 ASIL D

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announced its GD25/55 SPI NOR Flash Automotive-Grade Product Family has received ISO 26262:2018 ASIL D Automotive Functional Safety certification from SGS, the world's leading Testing, Inspection and Certification company. This achievement not only strongly validates the outstanding safety performance and reliability of the GD25/55 SPI NOR Flash product in demanding automotive applications but also further solidifies the company's leadership position in the SPI NOR Flash field.　　With the exponential growth in the number of automotive electronics and electrical components, the demand for safety is becoming increasingly critical. As the internationally recognized standard for automotive functional safety, ISO 26262 aims to reduce the risks associated with automotive electronics and electrical systems and ensure the safety performance of vehicles. Under the ISO 26262 framework, the ASIL (Automotive Safety Integrity Level) classification system divides functional safety into four levels, ranging from A (lowest) to D (highest). Level D represents the highest level of safety, meaning that development processes at this level are subject to the most stringent requirements.　　GigaDevice has always maintained a focus on precision and excellence in the automotive electronics field, with product quality at the core of its business development. In terms of quality management, the company’s automotive-grade Flash aims for a 0 PPM defect rate, continuously driving quality improvements and earning widespread trust from customers. To date, global shipments have surpassed 200 million units. In terms of functional safety, GigaDevice has strengthened its process systems and personnel management, continuously enhancing its functional safety management capabilities. After achieving ISO 26262 ASIL D process certification in 2023, the company’s automotive-grade SPI NOR Flash has now also received ASIL D functional safety certification. This demonstrates that GigaDevice has established a rigorous development process for automotive-grade chips, and based on this foundation, has developed the mature capability to design products that meet functional safety standards.　　The GD25/55 SPI NOR Flash Automotive-Grade Product Family strictly adheres to the AEC-Q100 Grade 1 standard and is manufactured using 55nm/45nm process technology. It supports operating voltages of 3V, 1.8V, and a range from 1.65V to 3.6V, with capacities ranging from 2Mb to 2Gb, fully meeting the code storage requirements of automotive electronics. In terms of read/write performance, it offers single-channel, dual-channel, quad-channel, and octal-channel communication modes, with data throughput rates of up to 400MB/s, ensuring efficient data transmission. The product also boasts 100,000 erase/write cycles and a data retention period of up to 20 years. For enhanced safety, products with capacities of 64Mb and above feature built-in ECC algorithms and CRC check functions, improving reliability and extending the product's lifespan.　　Currently, GD25/55 SPI NOR Flash Automotive-Grade Product Family are widely used by numerous domestic and international automakers and Tier 1 suppliers, serving key automotive electronics applications across a range of fields including In-Vehicle Infotainment, Intelligent Cockpits, Connected Car Systems, Advanced Driver Assistance Systems (ADAS), Autonomous Driving, Battery Management System, Domain Controllers, Central Computing, Central Gateways, and Zone Control Systems.　　Ruwei Su, GigaDevice Vice President and General Manager of Flash BU, stated: “As a critical medium for storing key code in automotive electronics, the functional safety of NOR Flash is essential to ensure the reliability and integrity of data in extreme environments, directly impacting the safety and stable operation of vehicles. GigaDevice GD25/55 SPI NOR Flash Automotive-Grade Product Family has obtained the ISO 26262:2018 ASIL D automotive functional safety certification, which fully demonstrates the company's strong capabilities in automotive-grade chip design. Moving forward, GigaDevice will continue to uphold high standards of automotive functional safety, strictly adhere to relevant process specifications, and provide global customers with more high-quality, highly reliable automotive-grade storage products.”
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Release time：2024-12-17 16:03 reading：930 Continue reading>>
GigaDevice Unveils the Industry's Smallest 128Mb SPI <span style='color:red'>NOR Flash</span> in 3x3x0.4mm FO-USON8 Package
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GigaDevice Unveils the Industry's Smallest 128Mb SPI NOR Flash in 3x3x0.4mm FO-USON8 Package

　　GigaDevice a semiconductor industry leader in flash memory, 32-bit microcontrollers, sensors, and analog technology, announces the launch of the industry’s smallest 128Mb SPI NOR Flash, GD25LE128EXH, in the ultra-compact 3x3x0.4mm FO-USON8 package. With its thickness of only 0.4mm, the GD25LE128EXH offers designers unparalleled flexibility in designing compact applications, making it the ideal code storage unit for IoT, wearables, healthcare, and networking products that demand high functionality and low power consumption.　　As a flagship product of GigaDevice's low power SPI NOR Flash series, the GD25LE128EXH features outstanding performance, with a maximum frequency of 133MHz and a data throughput of up to 532Mbit/s, significantly enhancing system access speed and instant-on capability. Compared to other industry products, the GD25LE128EXH operates at a lower read current of only 6mA when running at 4-channel 133MHz frequency, reducing the power consumption by 45% and effectively extending battery life. The GD25LE128EXH achieves an ultra-small size for 128Mb products by using the new FO-USON8 package, which reduces area by 70% and thickness by 50%, compared to the conventional 6x5x0.8mm WSON8 package typically used for such products. As a result, GD25LE128EXH takes up 85% less space and reduces material cost.　　The 3x3x0.4mm FO-USON8 GD25LE128EXH is also pin compatible with 64Mb and lower capacity 3x4x 0.6mm USON8 products, enabling quick density upgrades to 128Mb without changing the PCB layout.　　"As a leading fabless company, GigaDevice not only advocates for innovative technology, but also applies it in practice," said Mike Chen, Executive Director of GigaDevice Memory Business Unit, " Our new GD25LE128EXH, the industry's first 128Mb SPI NOR Flash in an ultra-small package, with its lower power consumption, perfectly suitable for any battery-powered design. We anticipate an increase in demand for high-density SPI NOR Flash that is small and power-efficient, and we are planning to develop a more comprehensive product portfolio using advanced package technology to address such needs in the near future.”　　The GD25LE128EXH is currently in mass production, please contact our sales and distributors for order information. The 3mmx2mmx0.4mm FO-USON8 GD25LE64E will be expected to provide samples in the end of May, contact our sales to get more details.
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Release time：2024-01-08 14:51 reading：2583 Continue reading>>
GigaDevice Introduces 1.2V SPI <span style='color:red'>NOR Flash</span> Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance
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GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance

　　GD25UF series featuring single 1.2V supply offers industry's lowest Active Read power consumption　　GD25UF's 1.2V capability enables a direct interface to SoCs and processors produced on advanced process nodes, reducing their die size and simplifying their power supply architecture　　Nuremberg, Germany – 14 March 2023 – GigaDevice, a semiconductor industry leader in Flash memory and 32-bit microcontrollers serving a broad range of technology innovations, today introduced the GD25UF series of SPI NOR Flash in its strategic roadmap of 1.2V Flash products supporting systems-on-chip (SoCs) and applications processors built on advanced process nodes. The GD25UF SPI NOR Flash products are optimized for applications that require ultra-low power consumption or a small board footprint.　　The GD25UF products operate at a supply-voltage range of 1.14V-1.26V .This is ideal for devices built on advanced process nodes and operating at a core voltage of 1.2V, as it provides for a simpler power system architecture, and for direct interfacing between the I/O pins of the SoC or processor and the GD25UF device.　　With the GD25UF products, GigaDevice provides better specifications than other competing 1.2V products in the parameters that manufacturers of mobile communications devices, wireless modems and wearable devices care most about. In low-power mode at a frequency of up to 50MHz, Active Read current can be as low as 0.4mA at slower frequencies. Deep power-down current of 0.1µA makes the GD25UF ideal for any battery-powered or wearable application. In addition, industry-best program and erase times help increase device manufacturing throughput while reducing system power consumption.　　In Fast Read mode, these Flash devices operate at up to 120MHz and achieve a data-transfer rate of up to 640Mbits/s. In low EMI mode, operating at 80MHz over a double transfer-rate (DTR) quad I/O interface, the GD25UF products achieve the same data-transfer rate of 640Mbits/s while minimizing clock-generated noise, an ideal feature for noise-sensitive wireless applications.　　The 64Mbit GD25UF64E is in production now. It is supplied in SOP8, 3mm x 4mm or 4mm x 4mm USON8 and WLCSP packages, or as a known good die. The 128Mbit GD25UF128E is sampling. Products with memory capacity of 32Mbits and 256Mbits are in development.　　Syed S. Hussain, Flash BU Global Segment Marketing of GigaDevice said: 'Users of chips manufactured at advanced process nodes require a new generation of low-voltage Flash memory products that are optimized for the demanding applications that they support, such as IoT devices, mobile phones, PCs and laptops, and consumer devices, e.g. portable healthcare, smart watch and battery-based devices. Today’s launch of the GD25UF64E 1.2V Flash product marks the start of a comprehensive roadmap of low-voltage Flash products from GigaDevice, providing OEMs with the mix of memory capacities, serial interfaces and security functions that they need for the next generation of system designs. There is a Megatrend, where one shrinks SoCs down to lowest process geometry a must requirement is peripherals needs to support 1.2VIO also. GigaDevice is uniquely positioned to win Ultra-low power and performance megatrend in new designs.'　　GigaDevice will be exhibiting its portfolio of Flash memory and microcontroller products at Embedded World　　Come and visit GigaDevice in person or through LIVESTREAM:　　GigaDevice Booth Hall 3A – 527: Embedded World, March 14 – 16, 2023, Exhibition Center Nuremberg, Germany.　　Conference Presentations:　　Performance, Efficiency and Reliability: GigaDevice's Arm® Cortex®-M33-based MCU Family.　　GigaDevice Flash Journey in Automotive: Flashes Low Voltage Mega-Trend
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Release time：2023-11-01 16:22 reading：1919 Continue reading>>
<span style='color:red'>NOR Flash</span> Standard Meets Instant-On Expectations
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NOR Flash Standard Meets Instant-On Expectations

　　Jedec's new xSPI standard for non-volatile memory (NVM) devices is aimed meeting the demands of instant-on applications while also maintaining performance standards for NOR flash sitting outside of the SoC.　　Adesto Technologies, known for its small, ultra-low power NVM products, is claiming to be first out the gate, having been working on products and collaborating on the standard for the past three years. In a telephone interview with EE Times, Adesto Chief Techology Officer Gideon Intrater said its eXecute-in-Place (XiP) EcoXiP product family takes advantage of the new Jedec standards to give customers such as system developers and controller designers assured compatibility with controllers and peripheral devices that should accelerate adoption.　　Developed by a task force comprised of representatives from most NOR flash device manufacturers and several PC and microcontroller companies, the xSPI standard establishes mechanical, electrical and transactional guidelines for developing high-throughput octal devices. Although Jedec has been a defining organization for NAND flash, said Intrater, until recently NOR flash has been somewhat of a "wild west” in terms of standards, which has led to divergent products for enabling communications between host controllers and memories and confusion for controller designers.　　NOR flash is "old in the tooth,” he said, but it's made progress in terms of process technology and the amount of bandwidth that you go can get out of devices has improved dramatically in the last decade. Recently emerged applications such as the Internet of Things (IoT) and automotive infotainment systems have created a great deal of demand for embedded devices that need more program memory than what can be implemented economically on-chip using embedded flash or SRAM. Intrater said Adesto's EcoXiP eliminates the need for on-chip embedded flash and the need for on-board flash to store firmware. It doubles processor performance, lowers system power consumption and reduces system costs compared to quad SPI devices.　　Intrater said IoT and embedded devices such as wearables, medical monitors, POS controllers and other connected embedded systems now must support higher levels of functionality, new wireless protocol stacks and advanced software. They must be designed to handle more intelligent local data processing, so they need more program-memory than what can be implemented economically on-chip using embedded flash or SRAM, and less than what is offered by the smallest DRAM devices.　　"A lot of companies are moving away from having a huge amount of NOR flash inside their SoCs,” Intrater said. "They're building SoCs where the flash is sitting outside. This allows them to build devices with more aggressive process technologies.” For this approach to make sense, the external interface needs to provide a level of performance that's not slower than on-chip.　　The xSPI electrical interface can deliver up to 400MBytes per second raw data throughput. Adesto's EcoXiP claims to deliver 2.4 times the CPU performance compared to existing quad devices and established new standards for an octal interface; eight parallel data (IO) lines are used in xSPI to further increase system performance by transferring more parallel bits in each clock cycle.　　Intrater said XiP shows a lot of promise for mid-sized IoT systems and makes it possible to have more program memory than what is available on-chip, flexibility in size of the program memory without the need to re-spin the SoC, and the ability to turn off the power to most or all of the SoC when not needed.　　Adesto is sampling a 32Mb device now, with a family of densities planned. The immediate market is for applications that require "instant on” capability, such as rear-view cameras and GPS in advanced driver-assistance systems (ADAS), as well as IoT devices that wake up to send data and shut down again. "There's instant on for security and the instant on for convenience,” said Intrater. "We don't like waiting as consumers.”　　Jim Handy, principal analyst with Objective Analysis, said many IoT applications need a richer complement of memory than most MCUs offer. "NOR flash makers can do well by supplying chips to satisfy this need. EcoXIP appears to be a good solution to the problem,” Handy said.　　NOR flash is going down a path that was paved by EEPROM, Handy said. "You used to have serial and parallel EEPROM and then it boiled down to just being the serial because the serial took fewer bonding pads, and we see the same kind of thing going on with NOR flash,”  he said.　　Handy said serial channels have seen a great deal of research over the last 20 years. "They've become extraordinarily fast,” he said.　　Adesto is likely first to market with a product based on the Jedec standard, Handy said, because it was already well ahead of the game before collaborating on the specs. However, he said, the Jedec standard doesn't always guarantee success. "There are Jedec standard devices that do very well business-wise, but there are also Jedec standard devices that do poorly,” he said. "There are non-standard devices that do very well and there are standard devices that do poorly.”　　The new xSPI standard is helpful in that in open up opportunities for other manufacturers to produce something that is pin compatible. "Companies that don't want to get themselves stuck in a sole-source situation will be to get multiple vendors simply because it's a Jedec standard,” he said. "That's where I think this thing is headed.”　　NOR flash serves a role as code storage for applications, which makes it ideal for devices such as NEST thermostat, rather than NAND, because they can be designed for a lot lower cost. "IoT is made to order for NOR flash,” Handy said. Cypress likes to point out that automotive makers like NOR flash because it makes the dashboard to start up as soon as get keys in the car. "We've had 70 to 80 years of dashboards waking up and being able to function immediately,” Handy said.　　Handy said one of the difficult decisions facing designers is whether they can put all code they need into the internal NOR of an MCU, or whether to put it in an external part, which costs more. "There are micro-controllers that have large NOR flash inside but they're extremely expensive,” he said. Products like those from Adesto make it easier for designers to put big programs into their systems because the cost penalties aren't as high. "It works to Adesto's advantage that people are focused on putting a lot of code into small controller-based applications,” Handy said.
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Release time：2017-09-21 00:00 reading：1139 Continue reading>>

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